The purpose of mounting is to protect the integrity of the edges of thematerial and facilitate the clamping of the sample.

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    Description

    Compression Mounting Resin

    Secure Firm Support

    Under high temperature and pressure, molten resinflows fully and penetrates into every tiny crevice ofthe sample, forming a dense, non-porous inlay thatfirmly encapsulates and supports the sample.

    Fast Speed

    The whole process (heating, pressurization, curing)takes only 10-15 minutes.

    Wide Variety of Application

    Available in resins with different properties (e.g.,general,transparent, conductive, edge-protecting,etc.) to meet diverse needs.

    Providing Good Results

    The cured resin exhibits extremely high hardnessand abrasion resistance.

    Increase Throughput

    Used together with fully automatic or semi-automat-ic mounting machines to have the highestthroughput.

     

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